利用E-CAP解决高性能高频应用中的功率解耦问题

IF 2.6 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Power Electronics Magazine Pub Date : 2023-09-01 DOI:10.1109/mpel.2023.3301415

Mukund Krishna, Luca Vassalli

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引用次数: 0

摘要

电容器作为电子产品中最基本的元件之一，在各种设计中被大量使用。移动电话、物联网设备和高性能计算应用等应用的一个关键要求是有效地解决最后一英里功率传输挑战，例如高性能处理器的高频功率需求，这是它们不可避免的基础。虽然传统的多层陶瓷电容器(mlcc)到目前为止已经满足了要求，但对功率密度的严格限制正在挑战现有模型的持续使用。

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Addressing Power Decoupling in High-Performance, High-Frequency Applications Using E-CAP

As one of the most basic and fundamental components in electronics, capacitors are used in large numbers across a variety of designs. A key requirement for applications such as mobile phones, IoT devices, and high-performance compute applications is to effectively address last mile power delivery challenges, such as high-frequency power demands for the high-performance processors that they are inevitably based on. While traditional multilayer ceramic capacitors (MLCCs) have fulfilled the requirements thus far, stricter constraints on power density are challenging the continued usage of the existing model.

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来源期刊

IEEE Power Electronics Magazine ENGINEERING, ELECTRICAL & ELECTRONIC-

CiteScore

2.80

自引率

4.30%

发文量