片上天线UHF RFID标签的全非接触式晶圆级测试

2018 13th International Conference on Design & Technology of Integrated Systems In Nanoscale Era (DTIS) Pub Date : 2018-04-09 DOI:10.1109/DTIS.2018.8368554

A. Finocchiaro, G. Girlando, Alessandro Motta, A. Pagani, G. Palmisano

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引用次数: 4

摘要

已演示了860-960 MHz RFID标签的完全非接触式晶圆级测试。首次通过电感耦合同时测试了30个带有片上天线(OCA)的RFID集成电路阵列。在EWS测试期间，防碰撞算法结合在每个设备的存储库上插入x-y坐标，可以识别晶圆片的每个标签。此外，晶圆划线线预切割允许避免在晶圆水平产生不希望的涡流。

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A fully contactless wafer-level testing for UHF RFID tag with on-chip antenna

A fully contactless wafer-level testing for 860–960 MHz RFID tags has been demonstrated. For the first time, an array of 30 RFID ICs with On-Chip-Antenna (OCA) has been simultaneously tested by inductive coupling. The anti-collision algorithm in combination with the insertion of x-y coordinates on the memory bank of each device during the EWS tests has allowed to identify each tag of the wafer. Moreover, a wafer scribe line pre-cutting has permitted to avoid undesired eddy currents generation at wafer level.

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来源期刊

2018 13th International Conference on Design & Technology of Integrated Systems In Nanoscale Era (DTIS)

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