Juniyali Nauriyal, Meiting Song, M. Granados-Baez, Yi Zhang, Jaime Cardenas
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Packaging Integrated Photonic Devices to Increase Scalability Using Laser Fusion Splicing
We present a novel technique for attaching fiber-arrays to photonic-chips in single-shot. We demonstrate a minimum loss of -1.4dB and -1.5dB per-facet with a variation of +/-0.2dB and 0.0dB through 8-fiber and 4-fiber arrays respectively.
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