成型复合导热系数对成型多芯片模组热性能的影响

[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 1993-02-02 DOI:10.1109/STHERM.1993.225335

K. Azar, C.D. Mandrone, J.M. Segelken

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引用次数: 3

摘要

探索性的工作已经进行了调查填充环氧系统的热管理增强塑料封装集成电路。通过计算研究了成型复合导热系数对成型多芯片模块热阻的影响。考虑了7种不同的成型导热系数。气流速度由自然对流向高速强迫对流转变。结果表明，在自然对流中，将成型复合材料的导热系数提高8倍，可使结对环境热阻降低20%，在高速强制对流中可使结对环境热阻降低54%

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Effect of molding compound thermal conductivity on thermal performance of molded multi-chip modules

Exploratory work has been carried out to investigate filled epoxy systems for thermal management enhancements for plastic encapsulated integrated circuits. A computational study was conducted to examine the effect of molding compound thermal conductivity on thermal resistance of a molded multi-chip module. Seven different molding thermal conductivities were considered. The air velocity was varied from natural convection to high-velocity forced convection. The results showed that an eight-fold increase in molding compound thermal conductivity reduces the junction-to-ambient thermal resistance by 20% in natural convection and by 54% in high-velocity forced convection.<>

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[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium

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