J. Sasaki, Y. Kaneyama, H. Honmou, M. Itoh, T. Uji
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Self-aligned Assembly Technology For Optical Devices Using AuSn Solder Bumps Flip-chip Bonding
A flip-chip bonding technique using AuSn solder bumps, which are mechanically formed an the substrate, has been developed. Self-aligned assembly used in laser diode chip was realized with /spl plusmn/1/spl mu/m bonding Positioning precision.
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