保护环布局对堆叠低压PMOS高压ESD防护的影响

S. Liao, Kai-Neng Tang, M. Ker, Jia-Rong Yeh, Hwa-Chyi Chiou, Yeh-Jen Huang, Chun-Chien Tsai, Yeh-Ning Jou, Geeng-Lih Lin
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引用次数: 2

摘要

静电放电(ESD)保护和防闭锁是CMOS集成电路的两个重要的可靠性问题,特别是在高压(HV)应用中。在这项工作中,已经成功地在0.5 μm HV工艺中验证了堆叠低压(LV) PMOS器件,为高压应用提供了高保持电压的高ESD电平。此外,为了在高压应用中获得高的ESD稳健性和无锁存抗扰度,在硅片上进一步研究了堆叠低压PMOS器件上的保护环布局。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of guard ring layout on the stacked low-voltage PMOS for high-voltage ESD protection
Electrostatic discharge (ESD) protection and latchup prevention are two important reliability issues to the CMOS integrated circuits, especially in high-voltage (HV) applications. In this work, the stacked low-voltage (LV) PMOS devices have been successfully verified in a 0.5-μm HV process to provide high ESD level with high holding voltage for HV applications. In addition, the guard-ring layout on the stacked LV PMOS devices was further investigated in silicon chip to get high ESD robustness and latchup-free immunity for HV applications.
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