SIC - MOS结构辐射硬度评估

J. Moreno, E. Cordero, D. López, S. Massetti, M. Cabello, V. Soler, P. Godignon, E. Maset
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引用次数: 0

摘要

众所周知,与标准硅器件相比,基于宽间隙半导体的器件在节省质量、提高功率密度方面具有潜在的优势[1]。这些组件可以承受的更高工作温度也可以减少目前用于冷却电力电子设备的功率预算。这些因素在空间应用中至关重要,例如SiC器件非常有前途。然而,在该领域,可靠性是最重要的要求,而辐射条件可能会影响这些新技术的使用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Assessing Radiation Hardness of SIC MOS Structures
It is widely known that devices based on wide gap semiconductors show potential benefits in terms of saving mass, increasing power densities compared with standard Silicon ones [1]. The higher operating temperatures these components can withstand can also reduce the power budget currently used for cooling down power electronics. These factors are critical in space applications where, for example SiC devices are very promising. However, in this field reliability is a paramount requirement, and radiation conditions can compromise the usage of these new technologies.
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