硅化工艺要求的硼磷硅酸盐玻璃回流退火热收支调整

ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.98EX187) Pub Date : 1998-11-24 DOI:10.1109/SMELEC.1998.781179

U. Hashim, B. Y. Majlis, S. Shaari

{"title":"硅化工艺要求的硼磷硅酸盐玻璃回流退火热收支调整","authors":"U. Hashim, B. Y. Majlis, S. Shaari","doi":"10.1109/SMELEC.1998.781179","DOIUrl":null,"url":null,"abstract":"Three process sequences of borophosphosilicate glass (BPSG) reflow have been tested and characterized. A combination of a CVD furnace and rapid thermal annealing has been used to see the impact on the BPSG reflow. Results obtained showed that the RTA process has the potential to compensate for the reduction of the CVD furnace process temperature. SEM micrographs have shown that the new BPSG process sequence exhibits similar glass flow characteristics to the conventional BPSG reflow process. On the other hand, rapid thermal annealing alone is not adequate to completely flow the glass.","PeriodicalId":356206,"journal":{"name":"ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.98EX187)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal budget adjustment of borophosphosilicate glass reflow-anneal for silicide process requirement\",\"authors\":\"U. Hashim, B. Y. Majlis, S. Shaari\",\"doi\":\"10.1109/SMELEC.1998.781179\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Three process sequences of borophosphosilicate glass (BPSG) reflow have been tested and characterized. A combination of a CVD furnace and rapid thermal annealing has been used to see the impact on the BPSG reflow. Results obtained showed that the RTA process has the potential to compensate for the reduction of the CVD furnace process temperature. SEM micrographs have shown that the new BPSG process sequence exhibits similar glass flow characteristics to the conventional BPSG reflow process. On the other hand, rapid thermal annealing alone is not adequate to completely flow the glass.\",\"PeriodicalId\":356206,\"journal\":{\"name\":\"ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.98EX187)\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-11-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.98EX187)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMELEC.1998.781179\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.98EX187)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMELEC.1998.781179","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

对硼磷硅酸盐玻璃(BPSG)三种回流工艺流程进行了测试和表征。采用CVD炉和快速热退火的组合来观察对BPSG回流的影响。结果表明，RTA工艺具有弥补CVD炉工艺温度降低的潜力。SEM显微图显示，新的BPSG工艺序列与传统的BPSG回流工艺具有相似的玻璃流动特征。另一方面，单靠快速热退火不足以使玻璃完全流动。

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Thermal budget adjustment of borophosphosilicate glass reflow-anneal for silicide process requirement

Three process sequences of borophosphosilicate glass (BPSG) reflow have been tested and characterized. A combination of a CVD furnace and rapid thermal annealing has been used to see the impact on the BPSG reflow. Results obtained showed that the RTA process has the potential to compensate for the reduction of the CVD furnace process temperature. SEM micrographs have shown that the new BPSG process sequence exhibits similar glass flow characteristics to the conventional BPSG reflow process. On the other hand, rapid thermal annealing alone is not adequate to completely flow the glass.

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ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.98EX187)

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