{"title":"半导体的未来;摩尔或更少","authors":"H. Veendrick","doi":"10.1109/TUTCAS.2001.946983","DOIUrl":null,"url":null,"abstract":"Scaling results in: increasing design productivity gap; increasing mask costs; increasing leakage currents; increasing noise while noise margins reduce; increasing test costs; increasing technology costs due to approaching the limits. Design measures to limit leakage and noise and to support testing and debug, require an increasing number of transistors (up to 20-40%) and more complex processes to support embedded options. The move to the next technology will become less and less commercially attractive.","PeriodicalId":376181,"journal":{"name":"Tutorial Guide. ISCAS 2001. IEEE International Symposium on Circuits and Systems (Cat. No.01TH8573)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-05-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The future of semiconductors; Moore or less\",\"authors\":\"H. Veendrick\",\"doi\":\"10.1109/TUTCAS.2001.946983\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Scaling results in: increasing design productivity gap; increasing mask costs; increasing leakage currents; increasing noise while noise margins reduce; increasing test costs; increasing technology costs due to approaching the limits. Design measures to limit leakage and noise and to support testing and debug, require an increasing number of transistors (up to 20-40%) and more complex processes to support embedded options. The move to the next technology will become less and less commercially attractive.\",\"PeriodicalId\":376181,\"journal\":{\"name\":\"Tutorial Guide. ISCAS 2001. IEEE International Symposium on Circuits and Systems (Cat. No.01TH8573)\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-05-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Tutorial Guide. ISCAS 2001. IEEE International Symposium on Circuits and Systems (Cat. No.01TH8573)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TUTCAS.2001.946983\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Tutorial Guide. ISCAS 2001. IEEE International Symposium on Circuits and Systems (Cat. No.01TH8573)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TUTCAS.2001.946983","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Scaling results in: increasing design productivity gap; increasing mask costs; increasing leakage currents; increasing noise while noise margins reduce; increasing test costs; increasing technology costs due to approaching the limits. Design measures to limit leakage and noise and to support testing and debug, require an increasing number of transistors (up to 20-40%) and more complex processes to support embedded options. The move to the next technology will become less and less commercially attractive.