0.8 /spl mu/m CMOS技术的器件设计、制造与表征

T. H. Ting, M. Ahmad, Roy Kooh Jinn Chye, R. Wagiran, B. Suparjo
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引用次数: 1

摘要

对0.8 /spl mu/m MIMOS CMOS技术的开发进行了深入的研究。器件设计和表征等问题得到了充分的考虑。NMOS和PMOS晶体管从基本概念和使用仿真工具,如TSUPREM-4和MEDICI设计。为了提高器件性能,器件设计约束如阈值电压变化、断开状态泄漏电流和漏极诱导势垒降低(DIBL)效应已经得到了认真的研究。此外,性能标准,如驱动电流能力也进行了检查。从硅中提取器件特性已在测试芯片上完成。根据实验结果,给出了大量的I-V图,并从输出和传输特性以及表面DIBL泄漏电流方面对数据进行了讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Device design, fabrication and characterization of 0.8 /spl mu/m CMOS technology
An intensive study has been conducted for the development of the MIMOS 0.8 /spl mu/m CMOS technology. Issues such as device design and characterization have been given much consideration. NMOS and PMOS transistors have been designed from basic concepts and using simulation tools such as TSUPREM-4 and MEDICI. Device design constraints such as threshold voltage variation, off-state leakage current and drain-induced barrier lowering (DIBL) effects have been seriously examined to improve device performance. Furthermore, performance criteria such as drive current capability have also been examined. Extraction of device characteristics from silicon has been performed on a test chip. Based on experimental results, numerous I-V plots are presented and the data are discussed in terms of output and transfer characteristics and surface DIBL leakage current.
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