MEMS IC概念用于先进的射频和毫米波通信

K. Grenier, D. Dubuc, N. Do, J. Busquere, F. Coccetti, A. Coustou, D. Dragomirescu, R. Plana
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引用次数: 0

摘要

本文旨在概述将嵌入下一代射频和毫米波模块的新架构,这些模块必须具有新的功能,如灵活性和可重构性,以匹配所有现有或即将出现的标准,适应性,可测试性,以“按需”优化性能,以提高自主性和可靠性。最后一个问题涉及到小型化,这将是为模块提供更高的紧凑性和减轻重量所必需的,这对嵌入式应用至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
MEMS IC concept for advanced RF and millimeterwave communications
This paper aims to give an overview of the new architecture that will be embedded with the next generation of RF and millimeterwave modules that will have to feature new functionalities as flexibility and reconfigurability to match with all the standard that are or that will emerge, adaptability, testability to optimize the performances "on demand" in order to improve the autonomy, the reliability. The last issue deals with the miniaturisation that will be necessary to have a higher compactness for the modules and a reduced weight that is crucial for embedded applications.
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