{"title":"半导体器件边际热改进的有效替代方案","authors":"B. Siegal, M. Berg","doi":"10.1109/STHERM.1994.288987","DOIUrl":null,"url":null,"abstract":"Using a variety of surface mount packages, this paper reports the results of using various different methods for improving semiconductor thermal performance. Starting off with a 64-lead Quad Flat Package (QFP), data are presented for several different thermal environment conditions and for several different package variations. The environmental conditions include still-air, heat sink and tape sink. The package variations studied include die attachment thickness, internal drop-in heat spreader, and encapsulant material variations. Data are also presented for two die-on-copper-slug packages (100-lead QFP and 44-lead PLCC) and for a standard (not thermally enhanced) package (56-lead SSOP), under still-air, moving-air, heat sink and tape sink environments.<<ETX>>","PeriodicalId":107140,"journal":{"name":"Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1994-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"An effective alternative for marginal thermal improvements of semiconductor devices\",\"authors\":\"B. Siegal, M. Berg\",\"doi\":\"10.1109/STHERM.1994.288987\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Using a variety of surface mount packages, this paper reports the results of using various different methods for improving semiconductor thermal performance. Starting off with a 64-lead Quad Flat Package (QFP), data are presented for several different thermal environment conditions and for several different package variations. The environmental conditions include still-air, heat sink and tape sink. The package variations studied include die attachment thickness, internal drop-in heat spreader, and encapsulant material variations. Data are also presented for two die-on-copper-slug packages (100-lead QFP and 44-lead PLCC) and for a standard (not thermally enhanced) package (56-lead SSOP), under still-air, moving-air, heat sink and tape sink environments.<<ETX>>\",\"PeriodicalId\":107140,\"journal\":{\"name\":\"Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.1994.288987\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.1994.288987","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An effective alternative for marginal thermal improvements of semiconductor devices
Using a variety of surface mount packages, this paper reports the results of using various different methods for improving semiconductor thermal performance. Starting off with a 64-lead Quad Flat Package (QFP), data are presented for several different thermal environment conditions and for several different package variations. The environmental conditions include still-air, heat sink and tape sink. The package variations studied include die attachment thickness, internal drop-in heat spreader, and encapsulant material variations. Data are also presented for two die-on-copper-slug packages (100-lead QFP and 44-lead PLCC) and for a standard (not thermally enhanced) package (56-lead SSOP), under still-air, moving-air, heat sink and tape sink environments.<>
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