{"title":"电源模块是电力电子的关键组件组","authors":"G. Majumdar","doi":"10.1109/PCCON.2007.372913","DOIUrl":null,"url":null,"abstract":"In this paper, the state-of-the-art key technologies related to the advancement of IGBT modules and IPMs as key components for a sustaining growth of power conversion technologies and equipment have been reviewed in the beginning part. In the later part, an analysis of the changing requirements from various application fields and projections of future growth for power modules required to comply with such needs will be made, including description about newer chip and packaging technologies. The paper will also highlight on the status and the possibilities of silicon carbide based power semiconductors for future power conversion applications.","PeriodicalId":325362,"journal":{"name":"2007 Power Conversion Conference - Nagoya","volume":"95 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-04-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Power Modules As Key Component Group For Power Electronics\",\"authors\":\"G. Majumdar\",\"doi\":\"10.1109/PCCON.2007.372913\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the state-of-the-art key technologies related to the advancement of IGBT modules and IPMs as key components for a sustaining growth of power conversion technologies and equipment have been reviewed in the beginning part. In the later part, an analysis of the changing requirements from various application fields and projections of future growth for power modules required to comply with such needs will be made, including description about newer chip and packaging technologies. The paper will also highlight on the status and the possibilities of silicon carbide based power semiconductors for future power conversion applications.\",\"PeriodicalId\":325362,\"journal\":{\"name\":\"2007 Power Conversion Conference - Nagoya\",\"volume\":\"95 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-04-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 Power Conversion Conference - Nagoya\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/PCCON.2007.372913\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 Power Conversion Conference - Nagoya","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PCCON.2007.372913","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Power Modules As Key Component Group For Power Electronics
In this paper, the state-of-the-art key technologies related to the advancement of IGBT modules and IPMs as key components for a sustaining growth of power conversion technologies and equipment have been reviewed in the beginning part. In the later part, an analysis of the changing requirements from various application fields and projections of future growth for power modules required to comply with such needs will be made, including description about newer chip and packaging technologies. The paper will also highlight on the status and the possibilities of silicon carbide based power semiconductors for future power conversion applications.