B. Hewitt, R. C. Ellis, Richard P. Thomas, R. Healy, M. Benedek
{"title":"大功率x波段砷化镓场效应晶体管","authors":"B. Hewitt, R. C. Ellis, Richard P. Thomas, R. Healy, M. Benedek","doi":"10.1109/EUMA.1979.332711","DOIUrl":null,"url":null,"abstract":"Design considerations and processing techniques related to high power X-band GaAs field effect transistors will be presented. Particular emphasis will be placed on the problems associated with common lead inductance, gate-drain breakdown voltage and thermal resistance. The microwave performance of large periphery designs (up to 10 mms) will be reported. The superior performance of via-hole source connected devices with integral plated heat sinks will be stressed.","PeriodicalId":128931,"journal":{"name":"1979 9th European Microwave Conference","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1979-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"High Power X-Band GaAs Field Effect Transistors\",\"authors\":\"B. Hewitt, R. C. Ellis, Richard P. Thomas, R. Healy, M. Benedek\",\"doi\":\"10.1109/EUMA.1979.332711\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Design considerations and processing techniques related to high power X-band GaAs field effect transistors will be presented. Particular emphasis will be placed on the problems associated with common lead inductance, gate-drain breakdown voltage and thermal resistance. The microwave performance of large periphery designs (up to 10 mms) will be reported. The superior performance of via-hole source connected devices with integral plated heat sinks will be stressed.\",\"PeriodicalId\":128931,\"journal\":{\"name\":\"1979 9th European Microwave Conference\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1979-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1979 9th European Microwave Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUMA.1979.332711\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1979 9th European Microwave Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUMA.1979.332711","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design considerations and processing techniques related to high power X-band GaAs field effect transistors will be presented. Particular emphasis will be placed on the problems associated with common lead inductance, gate-drain breakdown voltage and thermal resistance. The microwave performance of large periphery designs (up to 10 mms) will be reported. The superior performance of via-hole source connected devices with integral plated heat sinks will be stressed.