光电场可编程门阵列VLSI运行时的总电离剂量耐受评估

Hirotoshi Ito, Minoru Watanabe
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摘要

本文介绍了光电场可编程门阵列(FPGA)在工作时的总电离剂量耐受评估。该光电FPGA采用0.18 ${\ μ m}$标准互补金属氧化物半导体(CMOS)工艺技术制作。利用60 Co γ辐射源,在2.27 ~ 2.28 kGy/h的剂量率下,对光电FPGA进行了总电离剂量耐受试验。结果表明,该光电FPGA在2.27 ~ 2.28 kGy/h的剂量率下能够正常工作,且工作时的总电离剂量耐受大于80 Mrad。总电离剂量耐受结果比典型的抗辐射超大规模集成电路(vlsi)和典型的抗辐射fpga高80倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Total-ionizing-dose tolerance evaluation of an optoelectronic field programmable gate array VLSI during operation
This paper presents the total-ionizing-dose tolerance evaluation of an optoelectronic field programmable gate array (FPGA) during operation. The optoelectronic FPGA was fabricated using 0.18 ${\mu m}$ standard complementary metal oxide semiconductor (CMOS) process technology. An experiment assessing the total-ionizing-dose tolerance of the optoelectronic FPGA was conducted at a 2.27–2.28 kGy/h dose rate using a60 Co gamma radiation source. Results clarified that the optoelectronic FPGA can function correctly under a 2.27–2.28 kGy/h dose rate and that the total-ionizing-dose tolerance of the optoelectronic FPGA is greater than 80 Mrad during operation. The total-ionizing-dose tolerance result is 80 times higher than that of typical radiation-hardened very large scale integrated circuits (VLSIs) and typical radiation-hardened FPGAs.
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