晶粒结构特征对碲化铋基化合物热电性能的影响

O. Ivanov, M. Yaprintsev, A. Vasil'ev, E. P. Dan’shina
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引用次数: 0

摘要

分析了晶粒结构对Bi1.9Gd0.1Te3化合物热电性能(比电阻率和总导热系数)影响的具体机理。这些机制如下:1)在晶界处形成表面Te空位作为施主中心;2)在高温Te蒸发下对材料进行热处理,改变晶粒的元素组成,制备出具有所需平均晶粒尺寸的样品。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
EFFECT OF FEATURES IN GRAIN STRUCTURE ON THE THERMOELECTRIC PROPERTIES OF COMPOUNDS BASED ON BISMUTH TELLURIDE
Specific mechanisms of grain structure effect on the thermoelectric properties (specific electrical resistivity and total thermal conductivity) of the Bi1.9Gd0.1Te3 compound have been analyzed. These mechanisms are as follows: 1) forming the surface Te vacancies at grain boundaries acting as donor centres; 2) changing the elemental composition of the grains at high-temperature Te evaporation under thermal treatment of material to prepare the samples with desired average grain size.
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