O. Rusanen, Suvi Kela, P. Korhonen, P. Niskala, Tapio Rautiov, Tomi Simula
{"title":"可靠的智能模塑结构","authors":"O. Rusanen, Suvi Kela, P. Korhonen, P. Niskala, Tapio Rautiov, Tomi Simula","doi":"10.23919/empc53418.2021.9584945","DOIUrl":null,"url":null,"abstract":"IMSE (Injection Molded Structural Electronics) solutions are made by integrating and encapsulating printed electronics and standard electronic components within durable 3D injection-molded plastics. Part of the technology development is to ensure that electric components and materials, such as polymer substrates, functional inks, and surface mounting adhesives, form a reliable solution. The technology verification includes stringent reliability testing. The used tests are rapid change of temperature, high temperature ageing and steady-state temperature-humidity. Here we present an additional testing case: 3000 cycles of thermal cycling ($- 30^{\\circ}\\mathrm{C}\\dots$. $80^{\\circ}\\mathrm{C})$.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Reliable Smart Molded Structures\",\"authors\":\"O. Rusanen, Suvi Kela, P. Korhonen, P. Niskala, Tapio Rautiov, Tomi Simula\",\"doi\":\"10.23919/empc53418.2021.9584945\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"IMSE (Injection Molded Structural Electronics) solutions are made by integrating and encapsulating printed electronics and standard electronic components within durable 3D injection-molded plastics. Part of the technology development is to ensure that electric components and materials, such as polymer substrates, functional inks, and surface mounting adhesives, form a reliable solution. The technology verification includes stringent reliability testing. The used tests are rapid change of temperature, high temperature ageing and steady-state temperature-humidity. Here we present an additional testing case: 3000 cycles of thermal cycling ($- 30^{\\\\circ}\\\\mathrm{C}\\\\dots$. $80^{\\\\circ}\\\\mathrm{C})$.\",\"PeriodicalId\":348887,\"journal\":{\"name\":\"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-09-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/empc53418.2021.9584945\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/empc53418.2021.9584945","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
IMSE (Injection Molded Structural Electronics) solutions are made by integrating and encapsulating printed electronics and standard electronic components within durable 3D injection-molded plastics. Part of the technology development is to ensure that electric components and materials, such as polymer substrates, functional inks, and surface mounting adhesives, form a reliable solution. The technology verification includes stringent reliability testing. The used tests are rapid change of temperature, high temperature ageing and steady-state temperature-humidity. Here we present an additional testing case: 3000 cycles of thermal cycling ($- 30^{\circ}\mathrm{C}\dots$. $80^{\circ}\mathrm{C})$.