可靠的智能模塑结构

O. Rusanen, Suvi Kela, P. Korhonen, P. Niskala, Tapio Rautiov, Tomi Simula
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引用次数: 0

摘要

IMSE(注塑结构电子)解决方案是通过将印刷电子产品和标准电子元件集成并封装在耐用的3D注塑塑料中。技术发展的一部分是确保电子元件和材料,如聚合物基材,功能油墨和表面安装粘合剂,形成可靠的解决方案。技术验证包括严格的可靠性测试。常用的试验有快速温度变化试验、高温老化试验和稳态温湿度试验。这里我们提出了一个额外的测试案例:3000次热循环($- 30^{\circ}\ mathm {C}\dots$)。80 ^{\保监会}\ mathrm {C})美元。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reliable Smart Molded Structures
IMSE (Injection Molded Structural Electronics) solutions are made by integrating and encapsulating printed electronics and standard electronic components within durable 3D injection-molded plastics. Part of the technology development is to ensure that electric components and materials, such as polymer substrates, functional inks, and surface mounting adhesives, form a reliable solution. The technology verification includes stringent reliability testing. The used tests are rapid change of temperature, high temperature ageing and steady-state temperature-humidity. Here we present an additional testing case: 3000 cycles of thermal cycling ($- 30^{\circ}\mathrm{C}\dots$. $80^{\circ}\mathrm{C})$.
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