通过最先进的RF CMOS和SiGe BiCMOS技术实现无线通信

S. Chu, K. Chew, P. R. Verma, C. Ng, C. H. Cheng, N. Toledo, Y. K. Yoo, W. Loh, K. Leong, S.Q. Zhang, B. G. Oon, Y. W. Poh, T. Zhou, K. Khu, S. Lim
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引用次数: 5

摘要

如今,混合信号/射频片上系统(SOC)设计的技术选择一直受到源自规模化CMOS技术的性能增强和成本优势的推动。本文讨论了射频晶体管的性能改进所带来的技术缩减。对缩放RF CMOS和SiGe BiCMOS技术进行了比较,以突出在某些应用中使用SiGe HBT器件的好处。讨论的其他技术支持包括精确的、可扩展的模型和统计模型,以满足设计灵活性和稳健制造的需求。然后介绍了高Q电感器、高密度电容器和变容管作为射频电路的基本无源元件。还讨论了失配、温度线性和电压线性等模拟要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Enabling wireless communications with state-of-the-art RF CMOS and SiGe BiCMOS technologies
The choice of technology for today's mixed-signal/RF system-on-chip (SOC) designs has been driven by the performance enhancements and cost advantage derived from scaled CMOS technologies. This paper discusses the performance improvements of RF transistors resulting from technology downscaling. Comparisons between scaled RF CMOS and SiGe BiCMOS technologies to highlight the benefits of employing SiGe HBT devices in certain applications are made. Other technology enablements discussed include accurate, scalable models and statistical models to address the need for design flexibility and robust manufacturing. Thereafter the introduction of high Q inductors, high density capacitors and varactors as basic passive components for RF circuits are discussed. Analog requirements such as mismatch, temperature linearity and voltage linearity are also discussed.
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