电子元件的材料选择- Zytel®高温尼龙HTN和Zentie®LCP

Gregory Lau
{"title":"电子元件的材料选择- Zytel®高温尼龙HTN和Zentie®LCP","authors":"Gregory Lau","doi":"10.1109/PESA.2006.343064","DOIUrl":null,"url":null,"abstract":"This paper present the DuPont Engineering Polymers and discuss how the new industry regulations impact lead free (Pb-free) electronic component material selection. The material properties discussed include thermal resistance, flammability rating, moisture absorption sensitivity, dielectric performance, electrical insulation rating, mechanical and processing and environmental needs.","PeriodicalId":402403,"journal":{"name":"2006 2nd International Conference on Power Electronics Systems and Applications","volume":"90 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Material Selection of Electronic Components - Zytel® High Temperature Nylon HTN and Zentie® LCP\",\"authors\":\"Gregory Lau\",\"doi\":\"10.1109/PESA.2006.343064\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper present the DuPont Engineering Polymers and discuss how the new industry regulations impact lead free (Pb-free) electronic component material selection. The material properties discussed include thermal resistance, flammability rating, moisture absorption sensitivity, dielectric performance, electrical insulation rating, mechanical and processing and environmental needs.\",\"PeriodicalId\":402403,\"journal\":{\"name\":\"2006 2nd International Conference on Power Electronics Systems and Applications\",\"volume\":\"90 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 2nd International Conference on Power Electronics Systems and Applications\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/PESA.2006.343064\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 2nd International Conference on Power Electronics Systems and Applications","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PESA.2006.343064","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文介绍了杜邦工程聚合物,并讨论了新的行业法规如何影响无铅(Pb-free)电子元件材料的选择。讨论的材料性能包括耐热性、可燃性等级、吸湿敏感性、介电性能、电绝缘等级、机械和加工以及环境需求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Material Selection of Electronic Components - Zytel® High Temperature Nylon HTN and Zentie® LCP
This paper present the DuPont Engineering Polymers and discuss how the new industry regulations impact lead free (Pb-free) electronic component material selection. The material properties discussed include thermal resistance, flammability rating, moisture absorption sensitivity, dielectric performance, electrical insulation rating, mechanical and processing and environmental needs.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信