晶粒取向对划痕测试的影响

IRPN: Science Pub Date : 2017-12-21 DOI:10.2139/ssrn.3101693
M. Kothari, Yogesh S. Gaikhe, Taha Khot, A. S. Rao, A. Tewari
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引用次数: 1

摘要

机械加工是复杂、高应变率、高应变的变形/断裂过程。这也是工件的晶体结构及其相对于切削方向的取向的强烈作用。晶体取向对单晶材料切削力的影响已经被许多研究者研究过。然而,对多晶晶粒及其晶界效应的研究却很有限。因此,本研究的重点是在商业纯铝的划痕实验中,晶粒取向对力的影响。采用热处理循环使铝合金中粗晶粒(100 ~ 500 μ m)长大。通过电子后向散射衍射测定了其晶体结构,并以此作为划痕实验的基础。在不同晶粒取向和晶界条件下,测量了产生划痕所需的力。根据衬底晶粒结晶学和划痕方向对测得的力进行了合理化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of Grain Orientation on Scratch Testing
Machining is complex, high strain-rate and high strain deformation/fracture process. It is also a strong function of the crystal structure of the work piece and its orientation with respect to cutting direction. The effect of crystallographic orientation on cutting forces for single crystal material has been studied by many researchers in the past. However, a study of the same in polycrystal grains and effect of grain boundary (GB) is limited. Hence this work focuses on the effect of grain orientation on forces during scratch experiments on commercially pure aluminum. Heat treatment cycles were applied to grow coarse grains (100-500 um) in the aluminum alloy. The crystallographic structure was determined by Electron Backscatter Diffraction and was used as a basis for scratch experiments. The forces required to perform scratch were measured for different grain orientations and grain boundaries. The measured forces were rationalized based on the underlining grain crystallography and scratch direction.
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