{"title":"混合模式加载下Sn/3.5Ag/0.75Cu和63Sn/37Pb焊点的等温低周疲劳试验","authors":"T. Park, Soon-Bok Lee","doi":"10.1109/ECTC.2002.1008220","DOIUrl":null,"url":null,"abstract":"To give a proper and accurate estimation of the fatigue life of solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. The loading phase is controlled by the angle of loading direction. Experiments are conducted with 63Sn/37Pb and Sn/3.5Ag/0.75Cu solder joints. The isothermal mechanical low cycle fatigue tests were performed under several loading phases. Constant displacement controlled tests are performed using a micromechanical test apparatus. Failure patterns of the fatigue tests are observed and discussed. Morrow energy model was examined and found to be a proper low cycle fatigue model for solder joints.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Isothermal low cycle fatigue tests of Sn/3.5Ag/0.75Cu and 63Sn/37Pb solder joints under mixed-mode loading cases\",\"authors\":\"T. Park, Soon-Bok Lee\",\"doi\":\"10.1109/ECTC.2002.1008220\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To give a proper and accurate estimation of the fatigue life of solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. The loading phase is controlled by the angle of loading direction. Experiments are conducted with 63Sn/37Pb and Sn/3.5Ag/0.75Cu solder joints. The isothermal mechanical low cycle fatigue tests were performed under several loading phases. Constant displacement controlled tests are performed using a micromechanical test apparatus. Failure patterns of the fatigue tests are observed and discussed. Morrow energy model was examined and found to be a proper low cycle fatigue model for solder joints.\",\"PeriodicalId\":285713,\"journal\":{\"name\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2002.1008220\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008220","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Isothermal low cycle fatigue tests of Sn/3.5Ag/0.75Cu and 63Sn/37Pb solder joints under mixed-mode loading cases
To give a proper and accurate estimation of the fatigue life of solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. The loading phase is controlled by the angle of loading direction. Experiments are conducted with 63Sn/37Pb and Sn/3.5Ag/0.75Cu solder joints. The isothermal mechanical low cycle fatigue tests were performed under several loading phases. Constant displacement controlled tests are performed using a micromechanical test apparatus. Failure patterns of the fatigue tests are observed and discussed. Morrow energy model was examined and found to be a proper low cycle fatigue model for solder joints.
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