{"title":"多层陶瓷电容器基于物理的分布式模型","authors":"C. Sullivan, Yuqin Sun","doi":"10.1109/EPEP.2003.1250028","DOIUrl":null,"url":null,"abstract":"Measurements show that lumped RLC models for multilayer ceramic capacitors are inadequate. A new transmission-line model offers advantages over previous transmission-line models: a closer fit to measured data, and a physical basis for the model.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":"{\"title\":\"Physically-based distributed models for multi-layer ceramic capacitors\",\"authors\":\"C. Sullivan, Yuqin Sun\",\"doi\":\"10.1109/EPEP.2003.1250028\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Measurements show that lumped RLC models for multilayer ceramic capacitors are inadequate. A new transmission-line model offers advantages over previous transmission-line models: a closer fit to measured data, and a physical basis for the model.\",\"PeriodicalId\":254477,\"journal\":{\"name\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"12\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2003.1250028\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250028","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Physically-based distributed models for multi-layer ceramic capacitors
Measurements show that lumped RLC models for multilayer ceramic capacitors are inadequate. A new transmission-line model offers advantages over previous transmission-line models: a closer fit to measured data, and a physical basis for the model.