芯片上通信挑战的体系结构与物理解决方案

D. Burger
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引用次数: 0

摘要

在亚100纳米技术中,晶体管和全球导线速度之间的差距越来越大,给计算机架构师和电路设计师带来了许多挑战。在遥远的未来,无论是使用碳纳米管还是量子点,这一挑战在分子尺度的电线传输等技术中显得更加重要。当固定设计的面积随着特征尺寸的减小而减小时,使用恒定面积的未来设计将会迅速增加全局延迟。解决这些延迟的两种方法是:(1)使用信令和设计技术来减少实际延迟,以及(2)使用架构创新来减少在一般情况下信号必须传播的距离。在本次演讲中,在概述了通信延迟问题之后,我描述了当前旨在减少处理和存储系统信号的平均通信距离的研究。对于处理器设计,我将描述静态放置,动态发布(Static Placement, Dynamic Issue, SPDI)执行模型,该模型允许编译器将相互依赖的指令放置在彼此附近,并且正在TRIPS处理器中实现。我还将描述非均匀缓存访问(NUCA)设计,它试图减少缓存访问的平均信号距离。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Architectural versus physical solutions for on-chip communication challenges
The growing gap between transistor and global wire speeds in sub-100 nanometer technologies poses numerous challenges to computer architects and circuit designers. This challenge looks to be even more significant in far-future technologies such as molecular-scale wire transmission, whether using carbon nanotubes or quantum dots. While a fixed design scales as its area decreases with feature size reductions, future designs that use a constant area see rapidly increasing global latencies.Two approaches to address these latencies are (1) to use signaling and design techniques to reduce the actual latencies, and (2) to use architectural innovations to reduce the distance that signals must be propagated in the common case. In this talk, after an overview of the communication latency issue, I describe current research that aims to reduce the average distance communicated for processing and memory system signals. For processor designs, I will describe the Static Placement, Dynamic Issue (SPDI) execution model, which allows the compiler to place dependent instructions near one another, and which is being implemented in the TRIPS processor. I will also describe Non-Uniform Caches Access (NUCA) designs, which attempt to reduce average signal distance for cache accesses.
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