多辐射泄漏路径对共形屏蔽SiP接地通孔屏蔽效能的影响

2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO) Pub Date : 2020-12-07 DOI:10.1109/NEMO49486.2020.9343652

Tuomin Tao, Zheming Gu, Guang-Lai Hu, Weifeng Liu, E. Li

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引用次数: 2

摘要

通过对共形屏蔽封装系统(SiP)中三种主要辐射泄漏路径的分别分析，给出了其接地通孔的屏蔽效能。这三条路径的辐射会淹没地孔的SE, SiP的总体SE由屏蔽最弱的路径决定。所提出的方法和研究结果将有助于减少SiP中接地过孔的冗余设计。

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Impact of multiple radiation leak paths on shielding effectiveness of ground vias in conformal-shielded SiP

This paper presents the shielding effectiveness (SE) of the ground vias in conformal-shielded System-in-Package (SiP) by analyzing three main radiation leak paths separately. The SE of the ground vias can be submerged by radiation from those three paths and the overall SE of SiP is determined by the weakest-shielded path. The method proposed and the findings in the work will assist to decrease the redundant design of ground vias in SiP.

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来源期刊

2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)

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