{"title":"一种测量PCB上电场耦合产生的电磁干扰的方法","authors":"B. Pong, A.C.M. Lee","doi":"10.1109/PCCON.1997.638393","DOIUrl":null,"url":null,"abstract":"A new method to measure electric field coupling between PCB copper traces is presented. This method enables measurement of noise from waveforms obtainable from breadboard prototypes, which is available in an early stage in the design process. The measurement result can then be analyzed and provide information for further PCB design. This method is verified by experiments and applied to an off-line flyback converter.","PeriodicalId":262154,"journal":{"name":"Proceedings of Power Conversion Conference - PCC '97","volume":"31 2","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-08-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"A method to measure EMI due to electric field coupling on PCB\",\"authors\":\"B. Pong, A.C.M. Lee\",\"doi\":\"10.1109/PCCON.1997.638393\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new method to measure electric field coupling between PCB copper traces is presented. This method enables measurement of noise from waveforms obtainable from breadboard prototypes, which is available in an early stage in the design process. The measurement result can then be analyzed and provide information for further PCB design. This method is verified by experiments and applied to an off-line flyback converter.\",\"PeriodicalId\":262154,\"journal\":{\"name\":\"Proceedings of Power Conversion Conference - PCC '97\",\"volume\":\"31 2\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-08-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of Power Conversion Conference - PCC '97\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/PCCON.1997.638393\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Power Conversion Conference - PCC '97","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PCCON.1997.638393","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A method to measure EMI due to electric field coupling on PCB
A new method to measure electric field coupling between PCB copper traces is presented. This method enables measurement of noise from waveforms obtainable from breadboard prototypes, which is available in an early stage in the design process. The measurement result can then be analyzed and provide information for further PCB design. This method is verified by experiments and applied to an off-line flyback converter.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
