电机高压与轴间高频耦合路径的研究

S. Tsiapenko, H. Hirsch
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引用次数: 1

摘要

现代汽车动力传动系统的电气化给一线带来了新的问题。高功率电子设备,高容量高压电池和具有巨大功率密度的电机现在是车辆的常见属性。现有的低压(LV)车载电网被扩展为高压(HV)传动系统,这对电磁兼容性测试产生了很大的影响。低压电源传导和辐射的发射限值被调整,以适应具有更高振幅的新发射。为了满足高压系统的新限制,传动系统必须完全屏蔽。由于结构限制,在动力系统的电动轴周围应用屏蔽是不可行的。定子内部现有的磁场和轴承内部的绝缘故障使得耦合到轴非常有效,这导致不希望的轴电流。因此,动力传动系统必须符合低压车载电源系统电磁兼容性的规定限制。为了符合要求,高电压侧与机器轴之间的耦合路径应满足国际标准国际无线电干扰特别委员会25 (CISPR 25)[1]中定义的耦合衰减限值。本出版物描述了一种在工作状态下获得机器耦合衰减的方法,并将结果与CISPR 25中描述的相应限制进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of a High Frequency Coupling Path Between HV and Shaft of an Electric Machine
Electrification of the drivetrain in modern vehicles brings new problems to the front line. High power electronics, high capacity high voltage batteries and electric machines with vast power density are now common attributes for vehicles. Existing low voltage (LV) on-board power network was extended with a high voltage (HV) drivetrain, which made a great impact on electromagnetic compatibility compliance testing. Low voltage supply conducted and radiated emission limits were adapted by to fit new emissions with their much higher amplitudes. In order to fulfill new limits for HV systems the drivetrain must be fully shielded. Due to construction restrains, an application of a shield around the electric shaft of the powertrain is not feasible. Existing magnetic field inside the stator and insulation breakdowns inside of the bearings make coupling to the shaft very effective, which is resulting in undesirable shaft currents. Hence the drivetrain must comply with defined limits for the electromagnetic compatibility of low voltage on-board power systems. In order to comply, the coupling path between HV side and the shaft of the machine should fulfill the limits for coupling attenuation defined in the international standard International Special Committee on Radio Interference 25 (CISPR 25) [1]. This publication describes a method to obtain coupling attenuation of the machine in the operating state and presents results compared with the corresponding limits described in CISPR 25.
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