{"title":"一个4.32 GOPS 1w通用DSP,具有增强的无线通信指令集","authors":"A. Olofsson, F. Lange","doi":"10.1109/ISSCC.2002.992935","DOIUrl":null,"url":null,"abstract":"The authors present a 6 GOPS DSP which implements the TigerSharc architecture with an instruction set enhanced for wireless communication. It is implemented in a 0.13 μm CMOS process with 8 layers of copper interconnect and operates at 250 MHz with 1 W power dissipation under nominal conditions.","PeriodicalId":423674,"journal":{"name":"2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"A 4.32 GOPS 1 W general-purpose DSP with an enhanced instruction set for wireless communication\",\"authors\":\"A. Olofsson, F. Lange\",\"doi\":\"10.1109/ISSCC.2002.992935\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The authors present a 6 GOPS DSP which implements the TigerSharc architecture with an instruction set enhanced for wireless communication. It is implemented in a 0.13 μm CMOS process with 8 layers of copper interconnect and operates at 250 MHz with 1 W power dissipation under nominal conditions.\",\"PeriodicalId\":423674,\"journal\":{\"name\":\"2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315)\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.2002.992935\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2002.992935","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 4.32 GOPS 1 W general-purpose DSP with an enhanced instruction set for wireless communication
The authors present a 6 GOPS DSP which implements the TigerSharc architecture with an instruction set enhanced for wireless communication. It is implemented in a 0.13 μm CMOS process with 8 layers of copper interconnect and operates at 250 MHz with 1 W power dissipation under nominal conditions.