Fast thermal simulation of integrated systems using alternating-direction-implicit method

An efficient transient thermal simulation of complex integrated system is carried out based on the equivalent thermal model and alternating-direction-implicit (ADI) method. The temperature-dependent leakage power dissipation in chips is taken into account in the modeling. With the ADI technique, the heat conduction equations in the matrix form are solved with linear computational complexity and memory requirement. The validity and high-efficiency of the proposed method are demonstrated by the numerical examples.