全局顶可靠性表征:评价和分析方法

Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268) Pub Date : 1997-10-26 DOI:10.1109/PEP.1997.656487

R. Doyle, B. O'Flynn, W. Lawton, J. Barrett, J. Buckley

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引用次数: 1

摘要

全球顶封装在低端消费产品的电子组装中已被广泛接受。为了将这种封装方法扩展到高可靠性和恶劣环境条件下，需要对可用材料进行严格的评估。分析技术，以确定失效模式和机制也是必要的，以充分了解和提高全球顶级性能。本文概述了球形顶可靠性试验的结果，并包括破坏性和非破坏性分析技术的研究结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Glob-top reliability characterisation: evaluation and analysis methods

Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and nondestructive analysis techniques.

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Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268)

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