云制造在半导体行业的应用

Xinghao Wu, F. Qiao, K. Poon
{"title":"云制造在半导体行业的应用","authors":"Xinghao Wu, F. Qiao, K. Poon","doi":"10.1109/WSC.2014.7020081","DOIUrl":null,"url":null,"abstract":"This paper aims to shed some light on how the concept of cloud manufacturing has been applied to the semiconductor manufacturing operations. It starts with describing the challenges to the semiconductor manufacturing due to evolving of outsourcing business model in global context, then discusses the different forms of cloud manufacturing and proposes the semiconductor industry oriented architecture for cloud manufacturing. Serus is used as a case study to share how the cloud manufacturing has created the values for the customer and its outsourced suppliers in the semiconductor industry.","PeriodicalId":446873,"journal":{"name":"Proceedings of the Winter Simulation Conference 2014","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Cloud manufacturing application in semiconductor industry\",\"authors\":\"Xinghao Wu, F. Qiao, K. Poon\",\"doi\":\"10.1109/WSC.2014.7020081\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper aims to shed some light on how the concept of cloud manufacturing has been applied to the semiconductor manufacturing operations. It starts with describing the challenges to the semiconductor manufacturing due to evolving of outsourcing business model in global context, then discusses the different forms of cloud manufacturing and proposes the semiconductor industry oriented architecture for cloud manufacturing. Serus is used as a case study to share how the cloud manufacturing has created the values for the customer and its outsourced suppliers in the semiconductor industry.\",\"PeriodicalId\":446873,\"journal\":{\"name\":\"Proceedings of the Winter Simulation Conference 2014\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-12-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the Winter Simulation Conference 2014\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/WSC.2014.7020081\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the Winter Simulation Conference 2014","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WSC.2014.7020081","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8

摘要

本文旨在阐明如何将云制造的概念应用于半导体制造业务。首先描述了外包业务模式在全球范围内的发展给半导体制造带来的挑战,然后讨论了云制造的不同形式,并提出了面向半导体行业的云制造架构。以Serus为例,分享云制造如何为半导体行业的客户及其外包供应商创造价值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Cloud manufacturing application in semiconductor industry
This paper aims to shed some light on how the concept of cloud manufacturing has been applied to the semiconductor manufacturing operations. It starts with describing the challenges to the semiconductor manufacturing due to evolving of outsourcing business model in global context, then discusses the different forms of cloud manufacturing and proposes the semiconductor industry oriented architecture for cloud manufacturing. Serus is used as a case study to share how the cloud manufacturing has created the values for the customer and its outsourced suppliers in the semiconductor industry.
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