光电化学蚀刻大孔硅形貌的优化

Guozheng Wang, Shencheng Fu, Yanjun Gao, Ye Li, Xin Wang, Q. Duanmu
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引用次数: 2

摘要

在不同的实验条件下,包括蚀刻电压、电流密度和光源波长等,进行了大孔硅的光电化学蚀刻。采用扫描电镜和金相显微镜对大孔硅的表面、孔径和壁进行了观察。分析了影响孔隙形态的因素。确定了制备高性能大孔硅的实验参数。大孔硅的孔深可达300¿m,纵横比超过75,蚀刻与光电化学。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimization of macropore silicon morphology etched by photo-electrochemistry
Macropore silicon etching with photo-electro-chemistry was carried out under different experimental conditions, including etching voltage, current density and wave length of optical source et al. The surface, diameter of pore and wall of the macropore silicon were observed with Scanning Electronic Microscope (SEM) and Metallographic Microscope. The influencing factors on morphology of pore were analyzed. Experimental parameters for fabricating high properties macropore silicon were also determined. Macropore silicon with depth of pores up to 300 ¿m and aspect ratios more than 75 was etched with photo-electrochemistry.
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