超过摩尔路线图的SOI衬底

J. Raskin
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引用次数: 7

摘要

在过去的十年中,绝缘体上硅(SOI) MOSFET技术已经证明了其在高频(nmosfet达到接近500 GHz的截止频率)和恶劣环境(高温,辐射)商业应用中的潜力。SOI还具有高电阻率衬底性能,从而大大降低了衬底损耗。SOI技术也正在成为异构微系统应用程序的主要竞争者。在这项工作中,我们展示了SOI技术在射频CMOS集成以及在薄介质膜上构建薄膜传感器和三维微机电(MEMS)传感器和执行器与其相关的SOI CMOS电路协集成方面的优势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SOI substrates for More than Moore roadmap
This last decade silicon-on-insulator (SOI) MOSFET technology has demonstrated its potentialities for high frequency (reaching cut-off frequencies close to 500 GHz for nMOSFETs) and for harsh environments (high temperature, radiation) commercial applications. SOI also presents high resistivity substrate capabilities, leading to substantially reduced substrate losses. SOI technology is also emerging as a major contender for heterogeneous microsystems applications. In this work, we demonstrate the advantages of SOI technology for RF CMOS integration as well as for building thin film sensors on thin dielectric membrane and three-dimensional microelectromechanical (MEMS) sensors and actuators co-integrated with their associated SOI CMOS circuitry.
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