{"title":"光电互连问题的解决方案","authors":"S. Kumpatla, J. J. Casswell, J.F. Snowdon","doi":"10.1364/AOPT.2005.JWB2","DOIUrl":null,"url":null,"abstract":"Optoelectronic bonding has been performed onto sample MCMs, which are to be used for optical testing on HOLMS demonstrator. The photodiodes and VCSELs were successfully bonded, but we experienced problems attaching the Mixed Signal chips.","PeriodicalId":212240,"journal":{"name":"2005 OSA Topical Meeting on Information Photonics (IP)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-06-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Solutions to optoelectronic interconnect problems\",\"authors\":\"S. Kumpatla, J. J. Casswell, J.F. Snowdon\",\"doi\":\"10.1364/AOPT.2005.JWB2\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Optoelectronic bonding has been performed onto sample MCMs, which are to be used for optical testing on HOLMS demonstrator. The photodiodes and VCSELs were successfully bonded, but we experienced problems attaching the Mixed Signal chips.\",\"PeriodicalId\":212240,\"journal\":{\"name\":\"2005 OSA Topical Meeting on Information Photonics (IP)\",\"volume\":\"68 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-06-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 OSA Topical Meeting on Information Photonics (IP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1364/AOPT.2005.JWB2\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 OSA Topical Meeting on Information Photonics (IP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/AOPT.2005.JWB2","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Optoelectronic bonding has been performed onto sample MCMs, which are to be used for optical testing on HOLMS demonstrator. The photodiodes and VCSELs were successfully bonded, but we experienced problems attaching the Mixed Signal chips.
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