50 GHz低温低噪声放大器的模抑制封装

2012 7th European Microwave Integrated Circuit Conference Pub Date : 2012-10-01 DOI:10.23919/EUMC.2012.6459086

D. Henke, F. Jiang, S. Claude

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引用次数: 1

摘要

混合低温低噪声放大器通常被封装在带有几个偏置通道的金属外壳中。严格的加工公差是必要的固体夹紧盖子，以避免性能下降。提出了一种利用光子带隙(PBG)结构的新型封装方法。这大大放宽了对夹持的公差，导致自然偏置通道，抑制高阶模式，并为装配创造了广泛的开放通道。

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Mode suppressing packaging for 50 GHz cryogenic low-noise amplifiers

Hybrid cryogenic low-noise amplifiers are often enclosed in a metallic housing with several bias channels. Strict machining tolerance is necessary for solid clamping of the lid to avoid degradation in performance. A new packaging is proposed by applying photonic bandgap (PBG) structures; which greatly relaxes the tolerance on clamping, results in natural bias channels, suppresses higher order modes, and creates wide open access for assembly.

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2012 7th European Microwave Integrated Circuit Conference

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