Vacuum packaging using anodic bonding and emission characteristics of FED

In this paper, we suggest an FED packaging technology using the anodic bonding method. Amorphous silicon film deposited on glass was contacted with glass substrate followed by bonding. The glass-glass bonding is based on conventional silicon-glass bonding mechanism and was achieved successfully. The FED panel having an opened exhausting hole was formed by the glass frit process and sealed by capping glass. From leak test in a bonded interface, the inner pressure of panel was kept continuously during pumping out. A light emission was observed from the packaged 0.7-inch FED and the anode current was 34 /spl mu/A. Emission stability was constantly measured for 11 hours.