通过使用分子模型了解超低K介电材料的模量趋势

N. Iwamoto, L. Moro, B. Bedwell, P. Apen
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引用次数: 19

摘要

分子模型以前被用于研究模具附着、底填和内填配方的粘附力和表面能效应,目前被用于研究新型超低k纳米多孔介电材料的力学性能趋势,这些材料是霍尼韦尔正在开发的NANOGLASS/spl reg/多孔玻璃自旋(SOG)和GX3-P/sup TM/多孔有机材料。在考虑集成电路制造中的目标应用时,从分子水平理解材料性能的需求尤其可以理解。在这种微小的微观结构下,分子结构和体系结构对分子力学性能的影响变得越来越重要。此外,我们发现通过从分子水平了解配方对力学性能的影响,可以直接针对特定性能计划配方变化。虽然我们正在使用分子建模的许多方面来帮助我们理解SOG和有机介电性质,如密度、润湿性、溶解度和粘附性,但在本文中,我们集中报道了我们对模量的观察结果。我们的研究发现,我们可以很简单地将这些材料的实验模量与分子衍生模量联系起来。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Understanding modulus trends in ultra low K dielectric materials through the use of molecular modeling
Molecular modeling has previously been used to study adhesion and surface energy effects of die attach, underfill and viafill formulations, and is currently being used to study the mechanical property trends of the new class of ultra low k nanoporous dielectric materials, NANOGLASS/spl reg/ porous spin-on-glass (SOG) and GX3-P/sup TM/ porous organic, being developed within Honeywell. The need to understand material performance from a molecular level is especially understandable when considering the target application in IC fabrication. With such small microstructures, the impact of the molecular mechanical properties imparted by the molecular structure and architecture become more and more important. In addition, we are finding that by understanding the effects of the formulation on the mechanical properties from the molecular level, formulation changes can be planned directly targeted at specific properties. Although we are using many aspects of molecular modeling to help us understand SOG and organic dielectric properties such as density, wetting, solubility and adhesion, for this paper we have concentrated on reporting our observations on modulus. Our studies have found that we can correlate the experimental modulus of these materials very simply with a molecularly derived modulus.
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