紧凑(Wg/Lg=80/85nm) FDSOI 1T-DRAM由Meta Stable Dip编程

K. Romanjek, F. Andrieu, J. Cluzel, L. Brevard, P. Perreau, C. Tabone, G. Guégan, T. Poiroux
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引用次数: 3

摘要

我们展示了一种最紧凑的1晶体管DRAM (1T-DRAM)电池,采用超薄体和25nm薄埋氧化物(UTBB),栅极宽度为Wg=80nm,长度为Lg=35nm,用于嵌入式DRAM应用。我们优化了编程电压,并研究了器件几何形状(Wg, Lg)对1T-DRAM性能的影响。MSD (Meta Stable Dip)方法具有较高的读电流裕度值,可达224μA/μm。这是MSD方法在这种规模1t dram上的首次实验评估。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Compact (Wg/Lg=80/85nm) FDSOI 1T-DRAM programmed by Meta Stable Dip
We demonstrate one of the most compact 1 Transistor DRAM (1T-DRAM) cell on Ultra-Thin-Body and 25nm thin Buried oxide (UTBB) down to a gate width of Wg=80nm and length of Lg=35nm for embedded DRAM applications. We have optimized the programming voltages and studied the influence of the device geometry (Wg, Lg) on the 1T-DRAM performance. The Meta Stable Dip (MSD) method provides high read current margin values, reaching 224μA/μm. This is the first experimental assessment of the MSD approach on such scaled 1T-DRAMs.
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