磷化铟的低温外延生长

W. Chen, S.L. Yang, P.-L. Liu
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引用次数: 0

摘要

利用流量调制外延(FME)和热预裂技术,在低至330℃的温度下实现了InP的低温外延生长。该生长体系是一种改良的金属有机化学气相沉积(MOCVD)体系。随着生长温度的降低,生长速率降低。在质量输运受限和动力学受限体系中没有观察到明显的转变温度,这表明高活性烷基的使用大大增强了表面反应。增长率可能受到活性反应物供应的限制。与名义FME生长过程相比,在较低生长温度下(即从330℃到450℃)生长的InP同质层的电子迁移率提高了两倍,在InP/GaAs异质外延层的情况下,电子迁移率提高了近六倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low temperature epitaxial growth of indium phosphide
Low-temperature epitaxial growth of InP was achieved at a temperature as low as 330 degrees C using flow-rate modulation epitaxy (FME) with a thermal precracking technique. The growth systems was a modified metalorganic chemical vapor deposition (MOCVD) system. The growth rate decreased as the growth temperature was reduced. No clear transition temperature for mass-transport-limited and kinetic-limited regimes was observed, indicating that the highly reactive alkyl used greatly enhanced the surface reaction. The growth rate was probably limited by the supply of active reactants. Compared to the nominal FME growth process, the electron mobility was improved by a factor of two for InP homolayers grown at lower growth temperatures, i.e. from 330 degrees C to 450 degrees C. It was improved nearly sixfold in the case of InP/GaAs heteroepitaxial layers.<>
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