A literature survey on RF MEMS packaging

This paper presents the survey of different packaging schemes of RF MEMS switches for wireless application. To determine the reliability of RF MEMS switch that tends to fails due to improper packaging, environmental conditions and improper housing and sealing. This paper describes the different types of RF MEMS switch packaging for d.c to millimeter wave application and is often chosen for high degree of integration, high reliability and enormous advantage over Relay, PIN diode and FET. In this paper, we discuss the MEMS switch packaging, various types of substrate used for designing and the literature survey which we had done.