{"title":"参数产量优化","authors":"S. W. Director","doi":"10.1109/DFTVS.1991.199938","DOIUrl":null,"url":null,"abstract":"Yield loss can be characterized as either catastrophic or parametric. Catastrophic yield loss is primarily do to local, or spot, defects that occur in a manufacturing process. On the other hand, parametric yield loss is due to global disturbances, such as mask misalignment. In this paper the author explores these two different types of yield loss and then reviews some methods that have been developed to maximize parametric yield.<<ETX>>","PeriodicalId":440536,"journal":{"name":"[Proceedings] 1991 International Workshop on Defect and Fault Tolerance on VLSI Systems","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Optimization of parametric yield\",\"authors\":\"S. W. Director\",\"doi\":\"10.1109/DFTVS.1991.199938\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Yield loss can be characterized as either catastrophic or parametric. Catastrophic yield loss is primarily do to local, or spot, defects that occur in a manufacturing process. On the other hand, parametric yield loss is due to global disturbances, such as mask misalignment. In this paper the author explores these two different types of yield loss and then reviews some methods that have been developed to maximize parametric yield.<<ETX>>\",\"PeriodicalId\":440536,\"journal\":{\"name\":\"[Proceedings] 1991 International Workshop on Defect and Fault Tolerance on VLSI Systems\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[Proceedings] 1991 International Workshop on Defect and Fault Tolerance on VLSI Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DFTVS.1991.199938\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[Proceedings] 1991 International Workshop on Defect and Fault Tolerance on VLSI Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DFTVS.1991.199938","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Yield loss can be characterized as either catastrophic or parametric. Catastrophic yield loss is primarily do to local, or spot, defects that occur in a manufacturing process. On the other hand, parametric yield loss is due to global disturbances, such as mask misalignment. In this paper the author explores these two different types of yield loss and then reviews some methods that have been developed to maximize parametric yield.<>