金属靶功率对共溅射Sn-DLC和W-DLC薄膜性能的影响

G. Leal, Mariana Amorim Fraga, G. W. A. Cardoso, A. S. da Silva Sobrinho, M. Massi
{"title":"金属靶功率对共溅射Sn-DLC和W-DLC薄膜性能的影响","authors":"G. Leal, Mariana Amorim Fraga, G. W. A. Cardoso, A. S. da Silva Sobrinho, M. Massi","doi":"10.1109/SBMICRO.2015.7298111","DOIUrl":null,"url":null,"abstract":"There is a great interest in understanding the properties of sputtered DLC films in order to enable their wide application in electronic devices and sensors. In present study, metal-containing diamond-like carbon (Me-DLC) thin films were deposited on Si (100) substrates by DC magnetron co-sputtering using a carbon target under a fixed power (150 W) and a metal target (tin or tungsten) under varying power (10-30 W), while the other parameters were kept constant. The growth rate, chemical composition, structure and electrical resistivity of the Sn-DLC and W-DLC thin films were studied by mechanical profilometer, RBS, SEM, Raman spectroscopy and four points probe, respectively. The results showed that the growth rate of Sn-DLC thin film is higher than the W-DLC. Furthermore, the Sn incorporation in DLC films is higher than W-DLC for the same power applied to the metal target. Relationship between the electrical resistivity of both film types and the power applied was also observed.","PeriodicalId":342493,"journal":{"name":"2015 30th Symposium on Microelectronics Technology and Devices (SBMicro)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Effect of metal target power on the properties of co-sputtered Sn-DLC and W-DLC thin films\",\"authors\":\"G. Leal, Mariana Amorim Fraga, G. W. A. Cardoso, A. S. da Silva Sobrinho, M. Massi\",\"doi\":\"10.1109/SBMICRO.2015.7298111\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"There is a great interest in understanding the properties of sputtered DLC films in order to enable their wide application in electronic devices and sensors. In present study, metal-containing diamond-like carbon (Me-DLC) thin films were deposited on Si (100) substrates by DC magnetron co-sputtering using a carbon target under a fixed power (150 W) and a metal target (tin or tungsten) under varying power (10-30 W), while the other parameters were kept constant. The growth rate, chemical composition, structure and electrical resistivity of the Sn-DLC and W-DLC thin films were studied by mechanical profilometer, RBS, SEM, Raman spectroscopy and four points probe, respectively. The results showed that the growth rate of Sn-DLC thin film is higher than the W-DLC. Furthermore, the Sn incorporation in DLC films is higher than W-DLC for the same power applied to the metal target. Relationship between the electrical resistivity of both film types and the power applied was also observed.\",\"PeriodicalId\":342493,\"journal\":{\"name\":\"2015 30th Symposium on Microelectronics Technology and Devices (SBMicro)\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 30th Symposium on Microelectronics Technology and Devices (SBMicro)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SBMICRO.2015.7298111\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 30th Symposium on Microelectronics Technology and Devices (SBMicro)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SBMICRO.2015.7298111","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

为了使溅射DLC薄膜在电子器件和传感器中的广泛应用,人们对溅射DLC薄膜的特性有很大的兴趣。本研究采用直流磁控共溅射技术在Si(100)衬底上制备了含金属类金刚石(Me-DLC)薄膜,采用固定功率(150 W)的碳靶和不同功率(10-30 W)的金属靶(锡或钨),其他参数保持不变。采用机械轮廓仪、RBS、SEM、拉曼光谱和四点探针分别研究了Sn-DLC和W-DLC薄膜的生长速率、化学成分、结构和电阻率。结果表明,Sn-DLC薄膜的生长速率高于W-DLC薄膜。此外,在相同功率下,DLC薄膜中的Sn掺入量高于W-DLC薄膜。还观察了两种薄膜的电阻率与施加功率之间的关系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of metal target power on the properties of co-sputtered Sn-DLC and W-DLC thin films
There is a great interest in understanding the properties of sputtered DLC films in order to enable their wide application in electronic devices and sensors. In present study, metal-containing diamond-like carbon (Me-DLC) thin films were deposited on Si (100) substrates by DC magnetron co-sputtering using a carbon target under a fixed power (150 W) and a metal target (tin or tungsten) under varying power (10-30 W), while the other parameters were kept constant. The growth rate, chemical composition, structure and electrical resistivity of the Sn-DLC and W-DLC thin films were studied by mechanical profilometer, RBS, SEM, Raman spectroscopy and four points probe, respectively. The results showed that the growth rate of Sn-DLC thin film is higher than the W-DLC. Furthermore, the Sn incorporation in DLC films is higher than W-DLC for the same power applied to the metal target. Relationship between the electrical resistivity of both film types and the power applied was also observed.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信