无线测试系统级封装

International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006. Pub Date : 2006-09-05 DOI:10.1109/DTIS.2006.1708683

Serge Bernard, David Andreu, M. Flottes, P. Cauvet, Herve Fleury, Fabrice Verjus

{"title":"无线测试系统级封装","authors":"Serge Bernard, David Andreu, M. Flottes, P. Cauvet, Herve Fleury, Fabrice Verjus","doi":"10.1109/DTIS.2006.1708683","DOIUrl":null,"url":null,"abstract":"The paper shows a new concept for testing a system-in-package (SiP) using a wireless communication. Trends of the SiP technology put more economic and technical constraints onto the test, while the contactless test techniques represent an opportunity to overcome the inherent problems. In this paper, we introduce a new test concept based on a wireless communication, a specific test access mechanism (TAM), and an optimised architecture. Although this approach is dedicated to an intermediate test of SiP, we explore other potential applications of this technology","PeriodicalId":399250,"journal":{"name":"International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-09-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Testing system-in-package wirelessly\",\"authors\":\"Serge Bernard, David Andreu, M. Flottes, P. Cauvet, Herve Fleury, Fabrice Verjus\",\"doi\":\"10.1109/DTIS.2006.1708683\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper shows a new concept for testing a system-in-package (SiP) using a wireless communication. Trends of the SiP technology put more economic and technical constraints onto the test, while the contactless test techniques represent an opportunity to overcome the inherent problems. In this paper, we introduce a new test concept based on a wireless communication, a specific test access mechanism (TAM), and an optimised architecture. Although this approach is dedicated to an intermediate test of SiP, we explore other potential applications of this technology\",\"PeriodicalId\":399250,\"journal\":{\"name\":\"International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-09-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DTIS.2006.1708683\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DTIS.2006.1708683","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

摘要

本文提出了一种利用无线通信测试系统级封装(SiP)的新概念。SiP技术的发展趋势给测试带来了更多的经济和技术限制，而非接触测试技术则为克服这些固有问题提供了机会。本文提出了一种新的基于无线通信的测试概念、一种特定的测试访问机制(TAM)和一种优化的测试体系结构。虽然这种方法专门用于SiP的中间测试，但我们探索了该技术的其他潜在应用

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Testing system-in-package wirelessly

The paper shows a new concept for testing a system-in-package (SiP) using a wireless communication. Trends of the SiP technology put more economic and technical constraints onto the test, while the contactless test techniques represent an opportunity to overcome the inherent problems. In this paper, we introduce a new test concept based on a wireless communication, a specific test access mechanism (TAM), and an optimised architecture. Although this approach is dedicated to an intermediate test of SiP, we explore other potential applications of this technology

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来源期刊

International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.

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