基于片上通信架构的soc热管理

Aseem Gupta, S. Pasricha, N. Dutt, F. Kurdahi, K. Khouri, M. Abadir
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引用次数: 3

摘要

在当前的片上系统(SoC)设计中,管理峰值温度对于确保无故障运行至关重要。我们新颖的基于通信架构的热管理(CBTM)方案通过调节片上通信总线上的数据流来延迟所选ip块或组件的执行,从而管理组件的热行为。这种总线上的温度感知流量是通过响应传感器的热读数动态改变通信优先级表来实现的。使用CBTM,可以选择性地控制单个组件的温度。在本文中,我们展示了CBTM在四种工业规模SoC设计中的有效性,并评估了其性能影响。我们观察到CBTM保持了热阈值,并将SoC的峰值温度降低了29°C。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On chip Communication-Architecture Based Thermal Management for SoCs
In current Systems-on-Chip (SoC) designs, managing peak temperature is critical to ensure operation without failure. Our novel Communication Architecture Based Thermal Management (CBTM) scheme manages thermal behavior of components by delaying the execution of chosen IP-blocks or components by regulating the flow of data over the on-chip communication bus. This temperature aware traffic flow over the bus is achieved by dynamically changing the communication priority table in response to thermal readings from sensors. With CBTM, the temperatures of individual components can be controlled selectively. In this paper we demonstrate the effectiveness of CBTM on four industrial size SoC designs and also evaluate its performance impact. We observe that CBTM maintained thermal thresholds and reduced the peak temperature of an SoC by as much as 29°C.
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