使用环境传感器的非侵入性热建模技术用于绿化数据中心

Michael Jonas, G. Varsamopoulos, S. Gupta
{"title":"使用环境传感器的非侵入性热建模技术用于绿化数据中心","authors":"Michael Jonas, G. Varsamopoulos, S. Gupta","doi":"10.1109/ICPPW.2010.67","DOIUrl":null,"url":null,"abstract":"Previous research has demonstrated the potential benefits of thermal aware load placement and thermal mapping in cool-intensive environments such as data centers. However, it has proved difficult to apply existing techniques to live data centers because of models that are either unrealistic, require extensive sensing instrumentation, or because their creation is disruptive to the data center services. The work presented in this paper discusses techniques and their associated challenges with respect to creating an adaptive and non-invasive method of creating realistic and low-complexity thermal models using built-in and ambient sensors. Uses of these techniques can vary from assessing the thermal efficiency of the data center to designing a thermal-aware job scheduler to lower total cost of ownership (TCO). Specifically, this paper proposes: i) a non-invasive thermal modeling software architecture that uses on-board, ambient and software sensors ii) and four different ways of leveraging the gathered data from an experimental application of the architecture to improve the greenness of the data center and our understanding of the thermal behavior of a data center.","PeriodicalId":415472,"journal":{"name":"2010 39th International Conference on Parallel Processing Workshops","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Non-invasive Thermal Modeling Techniques Using Ambient Sensors for Greening Data Centers\",\"authors\":\"Michael Jonas, G. Varsamopoulos, S. Gupta\",\"doi\":\"10.1109/ICPPW.2010.67\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Previous research has demonstrated the potential benefits of thermal aware load placement and thermal mapping in cool-intensive environments such as data centers. However, it has proved difficult to apply existing techniques to live data centers because of models that are either unrealistic, require extensive sensing instrumentation, or because their creation is disruptive to the data center services. The work presented in this paper discusses techniques and their associated challenges with respect to creating an adaptive and non-invasive method of creating realistic and low-complexity thermal models using built-in and ambient sensors. Uses of these techniques can vary from assessing the thermal efficiency of the data center to designing a thermal-aware job scheduler to lower total cost of ownership (TCO). Specifically, this paper proposes: i) a non-invasive thermal modeling software architecture that uses on-board, ambient and software sensors ii) and four different ways of leveraging the gathered data from an experimental application of the architecture to improve the greenness of the data center and our understanding of the thermal behavior of a data center.\",\"PeriodicalId\":415472,\"journal\":{\"name\":\"2010 39th International Conference on Parallel Processing Workshops\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-09-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 39th International Conference on Parallel Processing Workshops\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICPPW.2010.67\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 39th International Conference on Parallel Processing Workshops","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICPPW.2010.67","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

摘要

先前的研究已经证明,在数据中心等冷密集型环境中,热感知负载放置和热映射的潜在好处。然而,事实证明很难将现有技术应用于实时数据中心,因为这些模型要么不切实际,要么需要大量的传感仪器,要么因为它们的创建对数据中心服务具有破坏性。本文介绍的工作讨论了关于创建使用内置和环境传感器创建逼真和低复杂性热模型的自适应和非侵入性方法的技术及其相关挑战。这些技术的用途多种多样,从评估数据中心的热效率到设计热感知作业调度器以降低总拥有成本(TCO)。具体而言,本文提出:i)一种非侵入式热建模软件架构,该架构使用板载、环境和软件传感器ii)以及利用从该架构的实验应用中收集的数据的四种不同方法,以提高数据中心的绿色度和我们对数据中心热行为的理解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Non-invasive Thermal Modeling Techniques Using Ambient Sensors for Greening Data Centers
Previous research has demonstrated the potential benefits of thermal aware load placement and thermal mapping in cool-intensive environments such as data centers. However, it has proved difficult to apply existing techniques to live data centers because of models that are either unrealistic, require extensive sensing instrumentation, or because their creation is disruptive to the data center services. The work presented in this paper discusses techniques and their associated challenges with respect to creating an adaptive and non-invasive method of creating realistic and low-complexity thermal models using built-in and ambient sensors. Uses of these techniques can vary from assessing the thermal efficiency of the data center to designing a thermal-aware job scheduler to lower total cost of ownership (TCO). Specifically, this paper proposes: i) a non-invasive thermal modeling software architecture that uses on-board, ambient and software sensors ii) and four different ways of leveraging the gathered data from an experimental application of the architecture to improve the greenness of the data center and our understanding of the thermal behavior of a data center.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信