SIMOX结构的植入损伤

N. Guillemot, J. Stoemenos, P. Normand, D. Tsoukalas
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引用次数: 0

摘要

只提供摘要形式。利用透射电子显微镜(TEM)和二次离子质谱(SIMS)研究了掺杂剂在后续退火过程中造成的注入损伤及其扩散。在SIMOX(氧注入分离)结构和块状硅中注入磷后,进行了TEM观察。结果表明,SIMOX结构总体上比体硅对注入更敏感,注入后非晶化更深,退火后表面更粗糙。SIMOX结构中掺杂剂浓度的SIMS测量表明,杂质的扩散率增强,并且在表面附近的浓度峰值约为砷的150 AA和硼的250 AA。结果表明:(1)杂质的捕获是由于掺杂物-污染物的固定络合物而不是表面的偏析;(2)掺杂物(主要是砷)的局部增强扩散与注入非晶化区域相对应。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Implantation damage in SIMOX structures
Summary form only given. Transmission electron microscopy (TEM) and secondary ion mass spectrometry (SIMS) have been used to study the implantation damage created by the dopants and their diffusion during subsequent annealing. TEM observations were performed after implantation of phosphorus in SIMOX (separation by implantation of oxygen) structures as well as in bulk silicon. The observations showed that the SIMOX structures are, in general, more sensitive to implantation than bulk silicon, revealing a deeper amorphization after implantation and a rougher surface after annealing. SIMS measurements of the dopant concentration in the SIMOX structures showed an enhanced diffusivity of the impurities as well as a peak of concentration near the surface that is about 150 AA for arsenic and 250 AA for boron. The results indicate that: (1) the trapping of the impurities is due to dopant-contaminant immobile complexes rather than to segregation at the surface: and (2) the locally enhanced diffusion of the dopants, mainly arsenic, corresponds to the region amorphized by the implantation.<>
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