光通信中高性能器件的混合集成技术

OFC/NFOEC 2008 - 2008 Conference on Optical Fiber Communication/National Fiber Optic Engineers Conference Pub Date : 2008-05-23 DOI:10.1109/OFC.2008.4528710

G. Maxwell

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引用次数: 29

摘要

本文综述了有源半导体器件与无源平面波导的光子混合集成技术及其成果。本文从成本、性能和集成复杂性三个方面说明了CIP平台的可扩展性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Hybrid Integration Technology for High Functionality Devices in Optical Communications

This paper reviews the techniques and results for photonic hybrid integration of active semiconductor devices and passive planar waveguides. The paper shows the CIP platform scaleability in terms of cost, performance and complexity of integration.

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来源期刊

OFC/NFOEC 2008 - 2008 Conference on Optical Fiber Communication/National Fiber Optic Engineers Conference

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