钛合金晶界附近损伤积累的数学模型

N. A. Knyazev, P. Volegov
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引用次数: 1

摘要

本文致力于描述和模拟α -钛合金两相邻晶粒边界附近的损伤形成过程。晶界附近微损伤的主要机制是单晶位错堆积的应力场。通过数值模拟,得到了具有六方闭合堆积(HCP)晶体结构的“硬”晶粒滑移系统在给定点处的切线应力和法向应力。此外,还建立了应力强度、最大正切应力和最大正切应力与相关特性的关系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Mathematical modeling of damage accumulation near grain boundaries in titanium alloys
The work is dedicated to describing and modeling of the damage formation process near a boundary of two adjacent grains in α−Ti alloy. The main microdamage mechanism near grain boundary was the stress field of a dislocation pile-up in one grain. As a result of numerical modeling, the resulting tangent and normal stresses in the slip systems of “hard” grain, with hexagonal closed packed (HCP) crystallographic structure, were obtained at a given point. In addition, the dependences of the stress intensity and maximum tangent and normal stresses on relevant characteristics were built.
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