采用InP DHBT技术的倒装1:4解复用集成电路，运行速度高达100gb /s

2007 European Microwave Integrated Circuit Conference Pub Date : 2007-12-17 DOI:10.1109/EUMC.2007.4405395

C. Karnfelt, J. Hallin, T. Kjellberg, B. Hansson, T. Swahn

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引用次数: 2

摘要

介绍了一种采用InP DHBT技术的封装1:4解复用器(DEMUX)，其输入数据速率高达100gb /s。DEMUX IC采用倒装芯片安装在微波封装中，该封装由氮化铝衬底组成，共面波导放置在带有同轴v型连接器的Kovar/MoCu外壳中。DEMUX在-3.5 V的电源电压下工作，功耗为2.1 W。

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Flip-chip mounted 1:4 demultiplexer IC in InP DHBT technology operating up to 100 Gb/s

Operation of a packaged 1:4 demultiplexer (DEMUX) in InP DHBT technology for an input data rate of up to 100 Gb/s is presented. The DEMUX IC is flip-chip mounted in a microwave package consisting of an aluminum nitride substrate with coplanar waveguides placed in a Kovar/MoCu housing with coaxial V-connectors. The DEMUX was operated at a supply voltage of -3.5 V and consumes 2.1 W.

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2007 European Microwave Integrated Circuit Conference

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