在超薄聚酰亚胺衬底上采用ZnO沟道和ZeocoatTM衬垫的亚微米沟道长度机械柔性垂直薄膜晶体管

Hyeong-Rae Kim, Sol-Mi Kwak, Furutua Mamoru, Sung‐Min Yoon
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引用次数: 0

摘要

在1.2 μm厚的聚酰亚胺衬底上制备了通道长度为200 nm的机械柔性垂直沟道薄膜晶体管(VTFT)。垂直栅堆除源极和漏极外,其余各层均采用原子层沉积法制备。ZeocoatTM薄膜是作为间隔层引入的,取代了之前含有氟离子的薄膜。经150℃后退火处理后,制备的柔性VTFT的转移特性达到了1.4×104的离子/IOFF。在正偏置和负偏置应力下,阈值电压的位移估计分别为+2.5 V和- 3.5 V,持续104 s。通过激光剥离工艺成功地将柔性vtft从载流子玻璃上剥离,并在不同曲率半径(Rc 's)的机械应变条件下进行了评估。即使在Rc为1 mm时,器件特性也没有显著变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Mechanically Flexible Vertical Thin-Film Transistor with Sub-Micrometer Channel Length Using ZnO Channel and ZeocoatTM Spacer on Ultra-Thin Polyimide Substrate
A mechanically flexible vertical-channel thin film transistor (VTFT) with a channel length of 200 nm was fabricated on a 1.2-μm-thick polyimide substrate. The vertical gate-stack was prepared by forming all the layers by atomic layer deposition except for the source and drain electrodes. The ZeocoatTM thin film was introduced as a spacer instead of the previous one containing fluorine ions. The transfer characteristics of the fabricated flexible VTFT achieved an ION/IOFF of 1.4×104 after the post annealing process at 150 °C. The shifts in threshold voltage under positive and negative bias stresses were estimated to be +2.5 and −3.5 V for 104 s, respectively. The flexible VTFTs were successfully delaminated from the carrier glass via a laser lift-off process and evaluated under mechanically strained conditions at various radius of curvatures (Rc’s). There were no significant changes in the device characteristics even at an Rc of 1 mm.
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