短时阈值电压漂移现象及其在结温估计中的应用

Xiang Wang, Haimeng Wu, V. Pickert
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摘要

近年来,碳化硅(SiC)在高效率、高频和高温应用方面取得了巨大的进步。然而,据报道,SiC MOSFET的栅极氧化物与硅相比较不太可靠,引入了阈值电压(Vth)移位的问题。最近的出版物主要基于从几秒到几天的长时间尺度来研究第v移。然而,在较短的时间尺度上,由于测量时对带宽的要求很高,因此尚未得到广泛的讨论和研究。本文提出了一种利用已开发的电流控制栅极驱动器进行短时v移的研究。捕获并分析了短时Vth位移现象,表明它发生在施加栅极电压的第一微秒内。此外,还提出了一种利用对数方程来描述短时v次位移与栅应力时间之间关系的建模方法。在不同温度下进行了实验,说明了短时Vth位移过程的温度依赖性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Phenomenon of Short-Time Threshold Voltage Shift and Its Application in Junction Temperature Estimation
Silicon carbide (SiC) has seen tremendous advancement in high-efficiency, high-frequency, and high-temperature applications during recent years. However, the gate oxide of SiC MOSFET is reported to be less reliable compared with its Si counterpart, introducing the problem of threshold voltage (Vth) shift. Recent publications have investigated Vth shift which are mainly based on the long-time scale ranging from seconds to several days. However, the Vth shift in a shorter time scale has not been widely discussed and studied due to its high bandwidth requirement in measurement. This paper proposed an investigation into the short-time Vth shift using a developed current-controlled gate driver. The phenomenon of short-time Vth shift is captured and analyzed, which shows that it occurs within the first microsecond of the gate voltage being applied. Moreover, a modelling approach using the logarithm equation is proposed to describe the relationship between the short-time Vth shift and the gate stress time. Experiments are conducted under different temperatures, illustrating the temperature dependency of the short-time Vth shift process.
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